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Our TEL-YSS-SI gap filler is revolutionizing the thermal coupling of electronicpackages and heatsinks. With its exceptionally high anisotropic thermal conductivity of 16 W/mK and #excellent force-deflection properties, it effortlessly bridges even larger gaps and tolerances. The specially formulated LV silicone base ensures maximum performance with minimal pressure, significantly reducing the overall thermal resistance.
Available as a 130 x 130 mm sheet or custom parts with thicknesses of 0.5 mm up to 3.0 mm and with optional adhesive strips or dots, TEL-YSS-SI offers maximum flexibility for a wide range of applications. Its outstanding softness and adaptability make it the ideal choice for thermal couplings in applications such as playing stations, CPU boards or heat pipe assemblies.
Whether it’s graphics card controllers, FBGAs, BGAs, CPUs or other electronic packages, TEL-YSS-SI ensures reliable, long-lasting, and vibration-dampening thermal management. Perfect for demanding applications where durability and performance are paramount!
Discover how TEL-YSS-SI can enhance your electronic systems with unmatched performance and reliability. Let’s connect and explore the possibilities together!
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