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Say hello to TGF-VP-SI, the electrically insulating, highly thermally conductive gap filler that’s designed to tackle even the most challenging thermal connections. With its silicone elastomer filled with ceramic powder, this gap filler effortlessly bridges large gaps caused by height differences or tolerances in electronic components, ensuring exceptional thermal conductivity.
What sets TGF-VP-SI apart is its natural tackiness quality, making it easy to pre-apply and ensuring a perfect fit with very low pressure. And for even more straightforward reliable pre-mounting, TGF-VP-SI-AD1 comes with an optional one-sided structural adhesive backing. Whether you’re working with #SMD components, #through-holevias, or #capacitors or # heatpipe assemblies this material guarantees a durable, vibration-dampening solution with minimal thermal resistance.
Ready to enhance your #thermalmanagement setup? Explore the TGF-VP-SI and TGF-VP-SI-AD1 and experience the difference it can make in your automotive applications, notebooks, and beyond. Let’s connect and take your projects to the next level!
Discover how TGF-VP-SI(-AD1) can enhance your electronic systems with unmatched performance and reliability. Let’s connect and explore the possibilities together!
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