With a thermalconductivity of 3.0 W/mK and its special formulation with ceramic powder, this gapfiller is perfect for thermal bonding across large gaps. Not only that – thanks to its extreme softness and conformability, it achieves optimum thermal contact even at extremely low pressure, which minimizes stress on the components and also the overall thermal transfer resistance at the same time.
And the best thing? This material is not only vibration-damping and extremely resistant to ageing and chemicals, but also self-adhesive, which makes pre-assembly child’s play. From SMD components and through-holevias to capacitors and components on heatpipes – TGF-MUS-SI is widely used in automotive applications, notebooks, medicaltechnology and industrial computers.
Which of your applications have we been able to improve with TGF-MUS-SI?
We look forward to your comments and suggestions!
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Looking for more details? Then have a look on the product site.
