🔥 Introducing TGF-USS-SI: The ultimate solution for enhanced #Thermalmanagement! 🔌🌡️
Looking for an electrically insulating, thermally conductive #siliconegapfiller that truly delivers exceptional performance? Look no further. Our TGF-USS-SI is engineered to excel in applications where thermal transfer across large gaps is a must, whether due to tolerances or stack-up variations. Thanks to its specialized formulation and ceramic particle filling, this silicone elastomer boasts an impressive thermal conductivity, making it the perfect choice to minimize total thermal resistance.
What sets TGF-USS-SI apart is its high softness and flexibility, allowing it to seamlessly conform to irregular surfaces, filling gaps with minimal pressure. Plus, its inherent tackiness simplifies pre-assembly, ensuring reliable results. And the benefits don’t stop there – this remarkable material offers extraordinary chemical resistance, shock absorption, and long-term stability. 🛠️🌟
From #SMD packages to #automotive applications, #laptops to embedded boards, TGF-USS-SI has you covered. Elevate your thermal link capabilities with this game-changing innovation! 🚗💻🏥
Curious? Get in touch with us now!
📞 +49 7021 73141 79
Looking for more details? Then check our site:
https://www.hala-tec.com/gap-filler-en/tgf-uss-si/.
